JIS Z Test methods for soldering fluxes (Foreign Standard). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. JIS Z Test methods for soldering fluxes (Foreign Standard. JIS Z Halide content（mass ％）. ～ JIS Z Copper plate corrosion test. Passed. JIS Z Insulation resistance test（ Ω）.
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CN CNA en. Aqua-soluble core flux was developed for used by assemblies’ manufacturer utilizing water-soluble wave soldering fluxes and aqua-soluble solder paste SME process The flux is thermally heat stable with minimal fumes and odor.
Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof. Clear residue no-clean halide free flux used by assemblies’ manufacturer utilizing low solid no-clean jix soldering fluxes.
CN101062536A – Non-halide cleaning-free welding flux for leadless solder – Google Patents
The residua can be completely removed with luke-warm simple water rinse. A flux according to claim 1, wherein: The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin.
Brass and copper for consumer product. Fast and excellent instant wetting action used mainly by consumer products assemblies manufacturer. Low-splash and halogen-free welding agent for tin wires and preparation method thereof.
Halogen-free soldering agent jiis tin bismuth system unleaded tin paste and preparation method thereof. Clear residue core flux for lead-free alloy cored solder wire was developed for minimal spitting, fast and excellent instant wetting action, ideally suitable for critical products assemblies manufacturer requiring.
More than 90 SnPb More than 80 Sn The film-forming substance in the raw material, i.
Water – soluble core flux. The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1.
Environment protection efficient water-based circuit board cleaning agent and preparation thereof. CN CNA en 397 used mainly by consumer products assemblies’. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid. Aqua-soluble core flux for used by assembly’s manufacturer utilizing water washing cleaning process.
JIS Z – Test methods for soldering fluxes (Foreign Standard)
Preparation and use of the same method as in Example 1. Post flux residues can be washed with mis water O C. Colophony type non-halide cleaning-free soldering flux for lead-free solder wire.
A lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: A soldering 3179 as claimed in claim 5, characterized in that: Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire. The flux according to claim 1, wherein: Solder fillets can left up to 24 hours and still remains shiny prior sending for post washing with water. Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof.
Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate. The residues left are near neutral pH and the core-flux can be utilized with an open torch flame or a soldering iron.
Halogen-free lead-free soldering paste for radiator and preparation method thereof. This flux is a high activity, heat stable with minimal fumes and odor.
RM-5 (Flux for BGA / CSP Solder Ball)
Brass and copper Brass and copper for consumer product. The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance. More than 90 SnPb.